Axis Robot - Company Ranking(32 companies in total)
Last Updated： Aggregation Period:Mar 04, 2026〜Mar 31, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
Ultra-high precision 6-axis alignment stage "RSTZ Series"
1 million yen-5 million yen |
【Specifications】 ■RSTZ-003 Table Size: Φ500mm Through Hole: Φ250mm Load Capacity: 300kgf (when evenly loaded) Motor Model: PK513-H10... | 【Examples of Use】 ■Wafer bonding ■Micro LED laser transfer ■Nanoimprint ■Sputtering (film deposition) ■Exposure ■Printed electronics | |
Ultra-High Precision Alignment Stage 'RST Aligner'
1 million yen-5 million yen |
【Other Features】 - Due to the structural design, it does not use bearings that impose restrictions on the size of the through holes, allowin... | 【Applications】 ■ Wafer bonding equipment ■ Exposure equipment ■ Electrical inspection equipment for various substrates ■ Submicron alignment... | |
Small 6-axis manipulator 'MPS-SSSD-B010'
1 million yen-5 million yen |
【Specifications (Excerpt)】 <Axis Name: X> ■Movement Range: ±5mm ■Maximum Speed: 1mm/sec ■Resolution: 0.1μm ■Driver Division: 1/10 *For more... | For more details, please refer to the PDF document or feel free to contact us. | |
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神津精機
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- Featured Products
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Ultra-high precision 6-axis alignment stage "RSTZ Series"
- overview
- 【Specifications】 ■RSTZ-003 Table Size: Φ500mm Through Hole: Φ250mm Load Capacity: 300kgf (when evenly loaded) Motor Model: PK513-H10...
- Application/Performance example
- 【Examples of Use】 ■Wafer bonding ■Micro LED laser transfer ■Nanoimprint ■Sputtering (film deposition) ■Exposure ■Printed electronics
Ultra-High Precision Alignment Stage 'RST Aligner'
- overview
- 【Other Features】 - Due to the structural design, it does not use bearings that impose restrictions on the size of the through holes, allowin...
- Application/Performance example
- 【Applications】 ■ Wafer bonding equipment ■ Exposure equipment ■ Electrical inspection equipment for various substrates ■ Submicron alignment...
Small 6-axis manipulator 'MPS-SSSD-B010'
- overview
- 【Specifications (Excerpt)】 <Axis Name: X> ■Movement Range: ±5mm ■Maximum Speed: 1mm/sec ■Resolution: 0.1μm ■Driver Division: 1/10 *For more...
- Application/Performance example
- For more details, please refer to the PDF document or feel free to contact us.
-
神津精機
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